ARRAYJ-30035-64P-PCB

ON Semiconductor’s range of J−Series SiPM sensors have been used to create high fill−factor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with industry−leading fill factor of up to 90%. The back of each ArrayJ has either one or more multi−way connectors, or a BGA (ball grid array). These allow access to the fast output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayJ products with connectors can be used to interface with the user’s own readout via a mating connector, or to a ON Semiconductor Breakout Board (BOB).

• Each SiPM sensor in the array has three electrical connections: fast output, standard output and common
• The substrates (cathodes) of all sensors are summed together to form the common I/O
• Each individual fast output and standard I/O (anode) are routed to its own output pin
• The ARRAYJ−60035−64P is comprised of 64 individual 6 mm J−Series sensors arranged in a 8 x 8 array
• The connections to each array are provided by two Samtec 80−way connectors, type QTE−040−03−F−D−A
• These connectors mate with the Samtec QSE−040−01−F−D−A board−to−board connector and the Samtec EQCD High Speed Cable Assemblies.

Warnungen und Hinweise

Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.