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Informations produit
Aperçu du produit
IS43QR16256B-083RBLI 256Mx16 DDR4 SDRAM is a high-speed dynamic random-access memory internally organized with eight banks (2 bank groups each with 4 banks). The DDR4 SDRAM uses a 8n prefetch architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR4 SDRAM consists of a single 8n-bit wide, four-clock data transfer at the internal DRAM core and eight corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write operations to the DDR4 SDRAM are burst-oriented, start at a selected location, and continue for a burst length of eight or a ‘chopped’ burst of four in a programmed sequence.
- Standard voltage is VDD = VDDQ = 1.2V, VPP=2.5V
- Data integrity, auto self refresh (ASR) by DRAM built-in TS, auto refresh and self refresh modes
- DRAM access bandwidth, separated IO gating structures by bank groups, self refresh abort
- Signal synchronization, write levelling via MR settings, read levelling via MPR
- Reliability and error handling, command/address parity, data bus write CRC, MPR readout
- Signal integrity, internal VREFDQ training, read preamble training, gear down mode
- Power saving and efficiency, POD with VDDQ termination, command/address latency (CAL)
- 96-ball FBGA package
- Industrial temperature rating range from -40°C to +95°C
- Speed grade (CL-TRCD-TRP) is 2400Mbps/16-16-16
Spécifications techniques
DDR4
256M x 16bits
FBGA
1.2V
-40°C
-
No SVHC (16-Jul-2019)
4Gbit
1.2GHz
96Broche(s)
Montage en surface
95°C
MSL 3 - 168 heures
Documents techniques (1)
Législation et Questions environnementales
Pays dans lequel la dernière étape de production majeure est intervenuePays d'origine :Taiwan
Pays dans lequel la dernière étape de production majeure est intervenue
RoHS
RoHS
Certificat de conformité du produit